JPH0117814Y2 - - Google Patents
Info
- Publication number
- JPH0117814Y2 JPH0117814Y2 JP16490884U JP16490884U JPH0117814Y2 JP H0117814 Y2 JPH0117814 Y2 JP H0117814Y2 JP 16490884 U JP16490884 U JP 16490884U JP 16490884 U JP16490884 U JP 16490884U JP H0117814 Y2 JPH0117814 Y2 JP H0117814Y2
- Authority
- JP
- Japan
- Prior art keywords
- battledore
- copper plate
- compression
- wire
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000006835 compression Effects 0.000 claims description 43
- 238000007906 compression Methods 0.000 claims description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 238000003780 insertion Methods 0.000 claims description 17
- 230000037431 insertion Effects 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 238000005260 corrosion Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000009415 formwork Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16490884U JPH0117814Y2 (en]) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16490884U JPH0117814Y2 (en]) | 1984-10-31 | 1984-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6180574U JPS6180574U (en]) | 1986-05-29 |
| JPH0117814Y2 true JPH0117814Y2 (en]) | 1989-05-24 |
Family
ID=30722771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16490884U Expired JPH0117814Y2 (en]) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0117814Y2 (en]) |
-
1984
- 1984-10-31 JP JP16490884U patent/JPH0117814Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6180574U (en]) | 1986-05-29 |
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